AMD has now introduced two new processors , the Sempron 210U and 200U. Featuring a lidless Ball Grid Array packaging, the two new low-power 65nm CPUs are set to be used for anything from enterprise-class thin client systems to point of sale kiosks, digital signage and more.
"These new lidless BGA packaged processors can help customers significantly shrink their embedded design into new smaller, flatter form factors without having to sacrifice any computing performance," said Buddy Broeker, director, Embedded Product Marketing, AMD. "Retail touch screens, self-service kiosks and digital signage are a growing part of the consumer experience and thin client computing continues to play a strong role in helping businesses become more efficient. These new processor features will help our customers stay on the cutting edge of embedded system design."
Specifications: the Sempron 210U and 200U have 256kB of L2 cache, integrated DDR2 memory controllers, frequencies of 1.5 GHz and 1.0 GHz respectively and TDPs of 15W and 8W.
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