32nm CPUs next year from AMD

Although Advanced Micro Devices was previously expected to get ready to produce central processing units under the 32-nanometer process technology only in 2011, it seems that the chip maker plans to speed things up a little. Dirk Meyer, chief executive of AMD, stated recently that the company was set to “ramp up” production in the middle of next year, and that it expected volume production to start in the fourth quarter of the year.

Currently, the CPUs shipped by both AMD and Intel are fabricated using the 45nm process. The Sunnyvale company has managed to come to the market with processors manufactured under the 45nm process only in the fourth quarter of last year, but it seems that it expects to be able to move to the next-generation 32nm fabrication by mid 2010.

Unlike the previous generation of chips made by AMD, the 32nm CPUs will only be designed by the company, The Foundry Company being the one that will take on the manufacturing process. It seemsthat the spinoff of its facilities into a new entity helped the chip maker keep on track with rolling out new-generation processors only about a year behind archrival Intel.

According to Meyer, AMD and Advanced Technology Investment Co., formed by the Abu Dhabi government, will close today the deal regarding the spinoff of the chip maker's manufacturing operations into a joint company. This move is expected to help AMD put an end to an entire line of quarterly loses.


Meyer says that the chip maker expects the Foundry Co to provide it with the necessary resources, mainly due to the fact that AMD will own 34 percent of the newly formed joint venture. At the same time, he seems to believe that the spinoff was a great move for AMD. “We've been actually impressed to see the quality and depth of the relationship a fabless company can have with its partners,” Meyer said.

source

Intel ready with its first 8-Core xeon processors

Santa Clara, California-based Intel is expected to detail one of its highest-anticipated server processors at the upcoming International Solid-State Circuits Conference in San Francisco between February 8 and 12, 2009. The chip maker is expected to provide an early look at its first eight-core chip, which will be part of the company's Xeon family of processors. These chips are to provide a new level of performance for server systems based on a dual-socket motherboard.

Unfortunately, at this time, there aren't any details regarding the Xeon processors to be discussed at the February 9 presentation. According to the ISSCC programme, executives of the global leading chip maker will be discussing an 8-core, 16-thread Xeon processor, which will be manufactured using a 45nm process technology. According to additional info, said processor will also be featuring 2.38 transistors and support operation of up to 6.4GT/s.

As expected, Intel is yet to officially comment on the respective Xeon processor, which it will likely do during the ISSCC event. “We are presenting 16 papers at ISSCC, but don't haveanything further to share at this point,” said Nick Jacobs, a company spokesman in Singapore.
According to the available details, Intel's presentation might just be related to the company's highly-anticipated Xeon processor that will be based on the Nehalem EP architecture. This server CPU is known to have been designed specifically for dual-socket servers and workstations. According to previous details, this processor line is due to be released sometime in early 2009.

The upcoming chips will sport some of the features currently available for Intel's other Nehalem-based chips, including the use of Intel's Quick Path Interconnect (QPI), which basically replaces the front side bus, featured on Intel's previous generation of Xeon processors. This feature boosts the computer's overall performance.

Transcend triple channel DDR3-1333 memory kits

Transcend Information Inc has released its DDR3-1333 triple channel memory kits for use with Intel Core i7 processors and Intel X58 Express Chipset motherboards. Transcend’s triple channel kits are designed specifically for the new platform, and offer an optimized combination of low voltage (1.5V), speed and enhanced latency (9-9-9-24) to deliver suitable performance and compatibility with next-generation PCs.

Available in two different capacities of 3GB (1GBx3) and 6GB (2GBx3), Transcend’s DDR3-1333 triple channel memory kits’ three identically matched DDR3 modules are carefully matched for use in triple-channel configuration, which together provide memory bandwidth of up to 32GB/sec. To ensure extra-stability and signal integrity, all DDR3 modules use robust PCBs that fully comply with JEDEC standards.Each chip is manufactured using small Fine-Pitch Ball Grid Array (FBGA) packages with extra contacts to assure better thermal dissipation, electrical efficiency and reliable computing quality.

Transcend memory modules are built to the highest specifications with the finest chips and materials available, and undergo rigorous testing to ensure they provide the best performance possible. All Transcend memory modules come with a lifetime warranty and the support of a global service network.

AMD's new Quad-Cores shipping started early

In a surprising move, online vendors have begun to offer AMD’s latest quad-core processors a while before they have been actually displayed to the public. The new processors on offer are the quad-core Phenol II chips, designed to run at at speeds from 2.8GHz to 3GHz and come with 8MB of cache.
Among these the Phenom II X4 920 runs at 2.8GHz and is being retailed for between $271 and $317 USD while the Phenom II X4 940 which runs at 3GHz is being sold foranything between $304 and $373 USD, depending on the online store. They run on DDR2 platforms and will be moved to DDR3 platforms based on the AM3 sockets, later this year.

This move comes as a big surprise, because AMD has not yet introduced these processors. Their launch is earmarked for CES 09, which will be held in January '09.

Shanghai Chips from AMD now available

AMD has released its new Shanghai platform, signaling a move to 45nm. The first chips out the door are quad-core Opteron parts, which AMD claims will deliver up to 35 percent more performance and up to a 35 percent decrease in power consumption when idle.Acording to CNet, a desktop platform (codenamed Dragon) consisting of 45nm Shanghai desktop CPUs along with AMD 700 series chipsets and ATI Radeon HD 4000 graphics will also see the light of day in the same time frame and attempt to compete with Intel's Core i7 platform.

"This enhanced AMD Opteron processor represents the most dramatic performance and performance-per-watt increases for AMD products since the introduction of the world's first x86 dual-core processors nearly four years ago," Randy Allen, AMD senior VP for Computing Solutions Group, said in a statement. "Simply put, the quad-core AMD Opteron is the right technology at the right time."Shanghai, which is essentially a refresh of Barcelona and not an entirely new architecture, supports DDR2-800 memory and comes with a tweaked Direct Connect Architecture. The current batch of 75-watt Shanghai chips will be followed up by a launch of 55-watt Opteron and an SE 105-watt part in Q1 2009.

Shanghai Chips from AMD now available

AMD pushes Fusion platform to 2011

AMD's executives gave an update of th company's progress toward profitability, products, marketing, manufacturing and operational initiatives on Thursday at the company's 2008 Financial Analyst Day in Sunnyvale, Calif.AMD has changed its original plans to introduce chips that combine CPU and and graphics cores to 2011, at a time where the when it will roll its first 32 nm products.

AMD pushes Fusion platform to 2011

The company has canceled its plans to release in 2010 its first dual-core 45 nm processor that would combine graphics and x86 cores. Instead, AMD will inntroduce in 2010 a four-core notebook processor in a BGA package.

AMD's "rival" Intel is expected to release a notebook processor that includes a graphics core in the end of 2009.AMD's first 32 nm processors will be delivered in 2011. The Orochi (UMPC/notebook) and Llano (mainstream desktop/notebook) chips will be the first to use AMD's next-generation Bulldozer core. The desktop chips will have four x86 cores and support four to eight Mbytes cache and DDR3 memory. The Llano chip will also include a graphics core.

Also in 2011, AMD will deliver Ontario, a 32nkm notebook chip with two x86 and one graphics core, supporting DDR3 memory.
Desktop/notebook Roadmap 2009-2010

AMD also provided details bout the CPU roadmap for mobile and desktop PCs for 2009/2010.

In 2009, the 45nm quad-core "Deneb" CPU (8m cache, DDR2/3) will power the entusiast desktop platforms. The "Propos" quad-core chips will be also available at that time featuring 2MB of cache and they will be found at mainstearm desktop PCs.

In the notebook segment for clients, AMD will release in 2009 the new 2-core "Caspian" CPU (2MB cache, DDR2) followed by the quad-core "Champlain" CPU (2MB cache, DDR3) in 2010. For ultramobiles, AMd prepares the "Conesus" (2-core, 1M cache, DDR2) chip for 2009 and the "Geneva" (2-core, 2M cache, DDR3) chip one year later.

Intel Core i7 Nehalem launching on November 17

Intel provided information about its next-generation micro-architecture (Nehalem) with the Core i7 processors at a media event on Wednesday in Athens, Greece, prior to the worldwide official release of the system on November 17.Intel Core i7 Nehalem launching on November 17

The event ran under the headline of "the fastest processor on the planet". The two major characteristics of the new i7 architecture are the triple-channel integrated memory controllers and the new interface called Quick Path Interconnect (QPI). Other highlights include the monolithic die to consolidate all four cores in a single piece of silicon, and the shared L3 cache. Further improvements include the use of the Hyper-threading as well as the Turbo Boost technologies. The Core i7 processors are also optimized to operate with Intel's X58 chipset.The Corei7 series will feature three quad-core models: The 2.66 GHz Core i7 920 will aim for the sub-$1000 class of PCs, the 2.93 GHz Core i7 940 for more expensive PCs in the $1500-$2000 range and the 3.2 GHz 965 Extreme Edition at enthusiast PCs.

The prices (1K pieces) of these CPUs are $999 for the Extreme Edition, $562 for the 940 and $284 for the 920.The X58 Express chipset covers both the northbridge/southbridge operations. The X58 IOH supports up to 36 PCIe 2.0 lanes. Depending on the processor model, QPI may run at either 6.4 GT/sec (Core i7-965) or 6.4 GT/sec (Core i7-940, i7-920) to communicate with the X58 Express chipset in each direction. This is twice the bandwidth of Intel's currently available X48 chipset, plus the full-duplex transport instead of the half-duplex. AMD's HyperTransport 3.0 still has an advantage herewith up to 41.6GB/s of bi-directional bandwidth.However, the X58 Express does not support the legacy PS/2 IDE, serial or parallel ports.

Turbo mode

Under the "TurboMode", the utilization of the number of active cores is used to adjust the frequency. For example, if only two cores are active, then there will be much more headroom within the thermal and power envelope and the CPU will be clocked higher. So the "turbo" frequencies of each core depend on the number of cores active. We could say that this is mainly a power saving feature.

Turbo Mode boasts single threaded applications as well as the performance of multi-threaded applications, according to Intel. Below is a graph that Intel showed with the Core i7 Extreme CPU to process in single-core and quad-core configurations, with Turbo Mode enabled. The graph shows the percent performance increase with Turbo Mode enable.
Technorati Tags: core i7, intel i7, chipset, core i7, gadgets, hardware, Intel, Nehalem Chipset, processor

Intel shows working 80-core processor

Last year, Intel announced a project to build a processor that would pack no less than 80 cores. While the idea may seem rather futuristic to some, the chip maker is reported to have already demonstrated the CPU at the Gitex Dubai trade show. Reports say that the Santa Clara based company wasn't shy at all at showcasing the processor, with the demonstration being made in the general public area outside of the trade show.

Intel shows working 80-core processor

As we all know, Intel has other multi-core projects in the pipeline, and Larrabee is one of them. However, the showcased processor was not Larrabee, but another CPU. The company is said to have started working on this CPU long before Larrabee came into play. The showcased CPU features 80 small cores, and is able to deliver 1 Teraflops of computing power. The 80-core chip is said to need only 78.35W of power, and that it features a 3.13GHz clock speed.

According to Fudzilla, Intel also detailed several other features of the CPU. The technology it comes with allows for almost all of the cores to be totally shut down when not needed. Also, it seems that the CPU can downclock all the way to 780MHz in such situations, and that the peak Teraflops performance will drop to 0.01. The CPU would only need 6.45W to compute the 4tile, 4x4 matrix mult withcomm equation.The research processor was built under the 65nm process and the company expects it to be ready for the market in the next five or seven years. It seems that Intel will come out with this eighty-core CPU as a part of the future line of sixteen, thirty two, sixty four CPUs, right before a ninety six-core version. The chip manufacturer considers the multi-core as being the near future for the CPU industry, although such an approach might sound rather idealistic.

Since the current multi-core processors are already facing problems concerning the lack of adequate software able to scale on a large number of cores, Intel should also consider conducting a research project in this area as well, so as to allow users to benefit from all the eighty featured cores.

Technorati Tags:intel, cpu, 80-core, processor, gpu, hardware

Rumours about Intel launching Montevina Platform for notebooks

Intel is going to update its Montevina notebook PC platform in April, 2009 with the introduction of the Montevina Refresh platform, according to a DIGITIMES report, which cites unnamed sources within Intel. The launch of the platform will be accompanied by two new processors, the Core 2 Duo T9900 and P8800.


Intel also plans to unveil its GM47 chipset for high-end notebooks in first quarter of next year. Entry-level and small form factor (SFF) PC will also not be over looked, as Intel will launch the GL43 and GS40 chipsets in July or August.A deluge of new processors for the Centrino 2 platform are soon going to be made available by the world’s leading chip maker. Also, the GM55 chipset for Intel’s upcoming 6th generation Centrino platform, Calpella, will become available in July or August next year.

Intel thinking use of jet engine's cooling technique

Intel is looking to cool your laptop with the exact same technology that a jet engine does. The issue of burning legs (that’s right, burning legs) has been an issue on the mind of Intel for some time now, and they’re looking to soothe that with their latest breakthrough.

Intel jet engine's cooling technique

Intel has been focusing on the increasing issue of hot thighs with something called Laminar Flow. Laminar Flow occurs when a fluid or gas/air flows in parallel layers, allowing a non-turbulent way to misdirect hot air away from the surface of a jet engine (or laptop). As demonstrated, this technology allows efficient cooling of temperatures upwards of 1,000 °C.A demo of this technology was given at this week’s Intel developer forum in Taiwan by Mooly Eden, Intel’s head of Mobile Platforms Group. “We are licensing it to our customers so they can keep making thinner and thinner laptops,” said Eden.

Technorati Tags:laptop, notebook, processor, intel jet cooling, jet engine cooling

Memory Kits For Intel i7 CPUs from OCZ

Memory Kits Optimized for Intel i7 CPUs from OCZ

OCZ Technology unveiled the industry's first triple channel memory kit designed specifically for the impending Intel Core i7 processor / Intel X58 Express Chipset, available in 3GB and 6GB kits.

The new memory modules are Optimized for the Core i7's triple channel mode, combining low voltage requirements, speed, and latency.

Memory Kits For Intel i7 CPUs from OCZ

Developed for enthusiasts and early-adopters, the low voltage OCZ Triple Channel solutions are the choice counterparts for leading-edge performance that won't inhibit the functionality of Core i7 CPUs."OCZ engineered these 3GB and 6GB kits specifically for Intel's imminent platform," commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. "By using special-screened, low voltage-capable ICs, these modules are the perfect complement for the Intel X58 Chipset to deliver the maximum performance by enabling low latency settings and higher system frequency."The advanced memory modules offer clock speeds up to 1600MHz at just 1.65V memory voltage. Elpida memory has also anounced the development of DDR3 memory that match these specifications.

OCZ will release the triple channel kits under the Platinum and Gold series designed specifically for enthusiasts and gamers:

OCZ PC3-10666 Gold 3GB (3X1GB) 1333MHz CL 9-9-9-20 1.65V
OCZ PC3-10666 Gold 6GB (3X2GB) 1333MHz CL 9-9-9-20 1.65V
OCZ PC3-12800 Gold 3GB (3x1GB) 1600MHz DDR3 CL8-8-8-24 1.65V
OCZ PC3-12800 Gold 6GB (3x2GB) 1600MHz DDR3 CL8-8-8-24 1.65V
OCZ PC3-10666 Platinum 3GB (3x1GB) 1333MHz CL7-7-7-20 1.65V
OCZ PC3-10666 Platinum 6GB (3x2GB) 1333MHz CL7-7-7-20 1.65V

OCZ?s Triple Channel kits feature propriety XTC (Xtreme Thermal Convection) heatspreaders. The company has not provided pricing details.

Cooler Master Hyper Z600

When you're looking for a silent cooler for your high-end PC or you want to overclock your CPU to it's maximum sooner or later you'll find yourself buying an expensive water based cooling system or a huge heat pipe cooler. In these days coolers like these are becoming easier to find. Some brands are a bit more interesting to the consumers though, because of their high availability, good reputation and balanced price (if possible), and that's the case with Cooler Master and their new cooler Hyper Z600, which very recently became available.

Cooler Master Hyper Z600

Cooler Master are the definite veterans in cooling technology. The brand is well known around the world and their products can be found in most PC stores. Aside from CPU coolers and full PC cooling solutions, the company also manufactures PC cases, PSUs, modding accessories, and many other things, and is a partner of NVIDIA and many other manufacturers, assisting them in the manufacture of coolers, cases and accessories for their products. Adding those things together makes the expectations for a top quality product logical. And that's exactly what Hyper Z600 is.Cooler Master Hyper Z600 comes well packed in it's cardboard box, wrapped with even more cardboard and a fine synthetic fiber, which helps the radiator fins stay intact even during it's extraction from the box.The size of Hyper Z600 isn't accidental. It's meant to be passive. It's no coincidence that it comes w/o a ventilator and that it has such dimestions. In a modern PC case the CPU cooler rests just below the PSU and often next to another ventilator that pulls air outside the box from behind. The X-Shape design of the Cooler Master Hyper Z600 allows easy airflow from every direction, so the whole work of creating a steady airflow to cool the CPU goes to the PSU this time (especially modern PSUs with a 120mm vent inside) and the rear vent. Of course the 6 heat pipes "take the blame" for supplying the fins with equal heat from each side.