MSI 1GHz HD 4890

MSI is working on a special Radeon HD 4890 which should be called MSI R4890 Cyclone, according to a recent post at Fudzilla.


The card features MSI SuperPipe cooler with four 8mm heatpipes, Hi-C CAPS which generates clean and stable power for the GPU, and 5+2 phase power supply. It might be another card with a GPU clock set at 1GHz, but it’s uncertain yet as the card is still under development.

MSI R4890 Cyclone is expected to show its face at ComputeX 2009 next month.

MSI 1GHz HD 4890

Intel New Chip Logos and Star Rating System

Intel has rolled out with new chip logos for its Core i7, Core 2, Centrino, Celeron and Pentium processors, and unveiled its Star Rating System with one star denoting the lowest performance and five stars the highest.


The 5-star level consists of Core i7 Series, QX9000 Series and several other high-end mobile CPUs. And Celeron falls to the lowest segment, including Celeron E1000, 400, T1000, 900, 700 and 500 Series.

Intel New Chip Logos and Star Rating System

32nm CPUs next year from AMD

Although Advanced Micro Devices was previously expected to get ready to produce central processing units under the 32-nanometer process technology only in 2011, it seems that the chip maker plans to speed things up a little. Dirk Meyer, chief executive of AMD, stated recently that the company was set to “ramp up” production in the middle of next year, and that it expected volume production to start in the fourth quarter of the year.

Currently, the CPUs shipped by both AMD and Intel are fabricated using the 45nm process. The Sunnyvale company has managed to come to the market with processors manufactured under the 45nm process only in the fourth quarter of last year, but it seems that it expects to be able to move to the next-generation 32nm fabrication by mid 2010.

Unlike the previous generation of chips made by AMD, the 32nm CPUs will only be designed by the company, The Foundry Company being the one that will take on the manufacturing process. It seemsthat the spinoff of its facilities into a new entity helped the chip maker keep on track with rolling out new-generation processors only about a year behind archrival Intel.

According to Meyer, AMD and Advanced Technology Investment Co., formed by the Abu Dhabi government, will close today the deal regarding the spinoff of the chip maker's manufacturing operations into a joint company. This move is expected to help AMD put an end to an entire line of quarterly loses.


Meyer says that the chip maker expects the Foundry Co to provide it with the necessary resources, mainly due to the fact that AMD will own 34 percent of the newly formed joint venture. At the same time, he seems to believe that the spinoff was a great move for AMD. “We've been actually impressed to see the quality and depth of the relationship a fabless company can have with its partners,” Meyer said.

source

Intel ready with its first 8-Core xeon processors

Santa Clara, California-based Intel is expected to detail one of its highest-anticipated server processors at the upcoming International Solid-State Circuits Conference in San Francisco between February 8 and 12, 2009. The chip maker is expected to provide an early look at its first eight-core chip, which will be part of the company's Xeon family of processors. These chips are to provide a new level of performance for server systems based on a dual-socket motherboard.

Unfortunately, at this time, there aren't any details regarding the Xeon processors to be discussed at the February 9 presentation. According to the ISSCC programme, executives of the global leading chip maker will be discussing an 8-core, 16-thread Xeon processor, which will be manufactured using a 45nm process technology. According to additional info, said processor will also be featuring 2.38 transistors and support operation of up to 6.4GT/s.

As expected, Intel is yet to officially comment on the respective Xeon processor, which it will likely do during the ISSCC event. “We are presenting 16 papers at ISSCC, but don't haveanything further to share at this point,” said Nick Jacobs, a company spokesman in Singapore.
According to the available details, Intel's presentation might just be related to the company's highly-anticipated Xeon processor that will be based on the Nehalem EP architecture. This server CPU is known to have been designed specifically for dual-socket servers and workstations. According to previous details, this processor line is due to be released sometime in early 2009.

The upcoming chips will sport some of the features currently available for Intel's other Nehalem-based chips, including the use of Intel's Quick Path Interconnect (QPI), which basically replaces the front side bus, featured on Intel's previous generation of Xeon processors. This feature boosts the computer's overall performance.

AMD's new Quad-Cores shipping started early

In a surprising move, online vendors have begun to offer AMD’s latest quad-core processors a while before they have been actually displayed to the public. The new processors on offer are the quad-core Phenol II chips, designed to run at at speeds from 2.8GHz to 3GHz and come with 8MB of cache.
Among these the Phenom II X4 920 runs at 2.8GHz and is being retailed for between $271 and $317 USD while the Phenom II X4 940 which runs at 3GHz is being sold foranything between $304 and $373 USD, depending on the online store. They run on DDR2 platforms and will be moved to DDR3 platforms based on the AM3 sockets, later this year.

This move comes as a big surprise, because AMD has not yet introduced these processors. Their launch is earmarked for CES 09, which will be held in January '09.

Intel announced completion of 32nm Process Development Phase

Intel announced that it had completed the development phase of its next-generation manufacturing process that further shrinks chip circuitry to 32 nanometers.

The company said that it is on track for production readiness of this future generation using even more energy-efficient, denser and higher performing transistors in the fourth quarter of 2009.Intel will provide technical details around the 32nm process technology along with several other topics during presentations at the International Electron Devices meeting (IEDM) next week in San Francisco.

Finishing the development phase for the company's 32nm process technology and production readiness in this timeframe means that Intel remains on pace with its ambitious product and manufacturing cadence referred to as the company's "tick-tock" strategy.That plan revolves around introducing an entirely new processor microarchitecture alternating with a cutting edge manufacturing process about every 12 months.

The Intel 32nm paper and presentation describe a logic technology that incorporates second-generation high-k + metal gate technology, 193nm immersion lithography for critical patterning layers and enhanced transistor strain techniques. These featuresenhanced transistor strain techniques. These features enhance the performance and energy efficiency of Intel processors. Intel's manufacturing process has the highest transistor performance and the highest transistor density of any reported 32nm technology in the industry, the company claims.

"Our manufacturing prowess and resulting products have helped us widen our lead in computing performance and battery life for Intel-based laptops, servers and desktops," said Mark Bohr, Intel Senior Fellow and director of process architecture and integration. "As we've shown this year, the manufacturing strategy and execution have also given us the ability to create entirely new product lines for MIDs, CE equipment, embedded computers and netbooks."

Other Intel IEDM papers will describe a low power system on chip version of Intel's 45nm process, transistors based on compound semiconductors, substrate engineering to improve performance of 45nm transistors, integrating chemical mechanical polish for the 45nm node and beyond; and, integrating an array of silicon photonics modulators. Intel will also participate in a short course on 22nm CMOS Technology.

Core 2 processors with TDP desktop systems

Despite the recent debut of solutions based on Nehalem architecture, marketed under the brand name of Core I7 few days, Intel seems not willing to stop the development of solutions Core 2 Duo systems for Socket 775 LGA least for the first part of 2009 .

The debut of some new cpu with Intel quad core architecture characterized by low levels of consumption of particular content, with maximum TDP in 65 Watt said.

The models are to debut Core 2 Quad Q9550, with clock frequency of 2.83 GHz and L2 cache of 12 Mbytes, Core 2 Quad Q9400 with clock of 2.66 GHz and 6 MB of L2 cache and Core 2 Quad Q8200 with clock of 2.33 GHz and L2 cache of 4 MB. For all these cpu are the same value as TDP quad pumped bus and by 1333 for MHz clock.he prices are respectively 369, 320 and 245 U.S. dollars excluding taxes.

The following versions of the processor that will be presented by Intel during the month of November.
Core 2 Extreme QX9300
Core 2 Quad Q9100
Core 2 Extreme X9100
Core 2 Duo T9600
Core 2 Duo P9500
Core 2 Duo T9400
Core 2 Duo P8600.

Shanghai Chips from AMD now available

AMD has released its new Shanghai platform, signaling a move to 45nm. The first chips out the door are quad-core Opteron parts, which AMD claims will deliver up to 35 percent more performance and up to a 35 percent decrease in power consumption when idle.Acording to CNet, a desktop platform (codenamed Dragon) consisting of 45nm Shanghai desktop CPUs along with AMD 700 series chipsets and ATI Radeon HD 4000 graphics will also see the light of day in the same time frame and attempt to compete with Intel's Core i7 platform.

"This enhanced AMD Opteron processor represents the most dramatic performance and performance-per-watt increases for AMD products since the introduction of the world's first x86 dual-core processors nearly four years ago," Randy Allen, AMD senior VP for Computing Solutions Group, said in a statement. "Simply put, the quad-core AMD Opteron is the right technology at the right time."Shanghai, which is essentially a refresh of Barcelona and not an entirely new architecture, supports DDR2-800 memory and comes with a tweaked Direct Connect Architecture. The current batch of 75-watt Shanghai chips will be followed up by a launch of 55-watt Opteron and an SE 105-watt part in Q1 2009.

Shanghai Chips from AMD now available

AMD pushes Fusion platform to 2011

AMD's executives gave an update of th company's progress toward profitability, products, marketing, manufacturing and operational initiatives on Thursday at the company's 2008 Financial Analyst Day in Sunnyvale, Calif.AMD has changed its original plans to introduce chips that combine CPU and and graphics cores to 2011, at a time where the when it will roll its first 32 nm products.

AMD pushes Fusion platform to 2011

The company has canceled its plans to release in 2010 its first dual-core 45 nm processor that would combine graphics and x86 cores. Instead, AMD will inntroduce in 2010 a four-core notebook processor in a BGA package.

AMD's "rival" Intel is expected to release a notebook processor that includes a graphics core in the end of 2009.AMD's first 32 nm processors will be delivered in 2011. The Orochi (UMPC/notebook) and Llano (mainstream desktop/notebook) chips will be the first to use AMD's next-generation Bulldozer core. The desktop chips will have four x86 cores and support four to eight Mbytes cache and DDR3 memory. The Llano chip will also include a graphics core.

Also in 2011, AMD will deliver Ontario, a 32nkm notebook chip with two x86 and one graphics core, supporting DDR3 memory.
Desktop/notebook Roadmap 2009-2010

AMD also provided details bout the CPU roadmap for mobile and desktop PCs for 2009/2010.

In 2009, the 45nm quad-core "Deneb" CPU (8m cache, DDR2/3) will power the entusiast desktop platforms. The "Propos" quad-core chips will be also available at that time featuring 2MB of cache and they will be found at mainstearm desktop PCs.

In the notebook segment for clients, AMD will release in 2009 the new 2-core "Caspian" CPU (2MB cache, DDR2) followed by the quad-core "Champlain" CPU (2MB cache, DDR3) in 2010. For ultramobiles, AMd prepares the "Conesus" (2-core, 1M cache, DDR2) chip for 2009 and the "Geneva" (2-core, 2M cache, DDR3) chip one year later.

Broad Software Ecosystem Support from AMD

AMD today announced ecosystem support by leading x86 operating system (OS) and virtualization partners for the new Quad-Core AMD Opteron processor, codenamed “Shanghai.” Built on 45nm process technology, the enhanced processor will offer innovations for AMD software partners like Microsoft, Red Hat, Sun Microsystems and VMware specifically designed to improve OS and virtualization performance. Strategic improvements in comparison to 65nm Quad-Core AMD Opteron processors include a larger L3 memory cache, and features designed to further optimize application performance in virtualized environments. The new AMD Opteron processor is uniquely architected to handle more memory-intensive applications while also enabling customers of all sizes to operate a flexible and scalable IT infrastructure.

“AMD is seeing rapid industry growth and demand for cutting edge technologies such as cloud computing and virtualization,” said Earl Stahl, vice president, Software Development, AMD. “As a result of our ongoing collaboration with software partners, AMD customers can soon easily upgrade to the new Quad-Core AMD Opteron processor. Enterprise customers can leverage the ongoing enhanced performance and features like AMD Virtualization (AMD-V) technology that AMD continues to deliver, while protecting the investments made to their current software infrastructure.”With more companies turning to virtualization to help improve data center efficiency and costs, AMD designed the new AMD Opteron processor to deliver a robust platform that can manage customers’ most demanding workloads, such as web hosting and complex database management, helping to maximize the business benefits of virtualization.

ISV Ecosystem Support

By collaborating with leading OS and virtual infrastructure vendors to help ensure applications are optimized for the new Quad-Core AMD Opteron processor, AMD is providing customers with greater opportunity to utilize the software solutions that best meet the needs of their businesses.

“With the adoption of Microsoft Windows Server 2008 Hyper-V to address customers’ infrastructure virtualization needs, it’s exciting to see the new Quad-Core AMD Opteron processor coming to market to help improve the performance and scalability of virtualized environments and help provide power savings benefits for customers,” said Mike Schutz, director of product management, Windows Server virtualization at Microsoft. “We look forward to continuing to work closely with AMD to help customers utilize virtualization technologies and enable businesses of all sizes to make the most of their IT investments.”

“Red Hat is committed to bringing performance, reliability and security to our customers as they expand their use of open source virtualization throughout the enterprise,” said Brian Stevens, CTO at Red Hat. “As evidenced by our recent collaboration with AMD on live migration technology, Red Hat continues to deliver business value to customers via high-performance, standards-based virtualization solutions for heterogeneous environments.”

“Sun is committed to working with AMD to include optimization and tuning advancements in the Sun xVM virtualization software portfolio in order to meet the desktop and server virtualization requirements of our customers,” said Jim McHugh, vice president of marketing, Datacenter, Sun Microsystems. “Sun xVM Server, a datacenter-grade server virtualization solution, runs on 45 nm Quad-Core AMD Opteron™ processor-based systems and offers customers the ability to virtualize and manage heterogeneous workloads, including Windows, Linux and Solaris™ operating systems, as guests. Sun xVM Server is an easy-to-use, open source hypervisor that enables a simplified and secure environment for our customers.”

“The VMware platform helps AMD customers to minimize capital and operating costs, increase availability of mission-critical applications, and promote energy efficiencies,” said Shekar Ayyar, vice president of infrastructure alliances, VMware. “The advanced virtualization features in the new Quad-Core AMD Opteron processors, such as AMD Extended Migration and AMD-V with Rapid Virtualization Indexing, can extend those benefits to optimize application performance in VMware virtualized environments.”

AMD also recognizes support for its forthcoming and current Quad-Core AMD Opteron processors from software and virtualization partners such as Parallels, Transitive and Virtual Iron. For more information about the software support of the Quad-Core AMD Opteron processor. source

Intel Core i7 Nehalem launching on November 17

Intel provided information about its next-generation micro-architecture (Nehalem) with the Core i7 processors at a media event on Wednesday in Athens, Greece, prior to the worldwide official release of the system on November 17.Intel Core i7 Nehalem launching on November 17

The event ran under the headline of "the fastest processor on the planet". The two major characteristics of the new i7 architecture are the triple-channel integrated memory controllers and the new interface called Quick Path Interconnect (QPI). Other highlights include the monolithic die to consolidate all four cores in a single piece of silicon, and the shared L3 cache. Further improvements include the use of the Hyper-threading as well as the Turbo Boost technologies. The Core i7 processors are also optimized to operate with Intel's X58 chipset.The Corei7 series will feature three quad-core models: The 2.66 GHz Core i7 920 will aim for the sub-$1000 class of PCs, the 2.93 GHz Core i7 940 for more expensive PCs in the $1500-$2000 range and the 3.2 GHz 965 Extreme Edition at enthusiast PCs.

The prices (1K pieces) of these CPUs are $999 for the Extreme Edition, $562 for the 940 and $284 for the 920.The X58 Express chipset covers both the northbridge/southbridge operations. The X58 IOH supports up to 36 PCIe 2.0 lanes. Depending on the processor model, QPI may run at either 6.4 GT/sec (Core i7-965) or 6.4 GT/sec (Core i7-940, i7-920) to communicate with the X58 Express chipset in each direction. This is twice the bandwidth of Intel's currently available X48 chipset, plus the full-duplex transport instead of the half-duplex. AMD's HyperTransport 3.0 still has an advantage herewith up to 41.6GB/s of bi-directional bandwidth.However, the X58 Express does not support the legacy PS/2 IDE, serial or parallel ports.

Turbo mode

Under the "TurboMode", the utilization of the number of active cores is used to adjust the frequency. For example, if only two cores are active, then there will be much more headroom within the thermal and power envelope and the CPU will be clocked higher. So the "turbo" frequencies of each core depend on the number of cores active. We could say that this is mainly a power saving feature.

Turbo Mode boasts single threaded applications as well as the performance of multi-threaded applications, according to Intel. Below is a graph that Intel showed with the Core i7 Extreme CPU to process in single-core and quad-core configurations, with Turbo Mode enabled. The graph shows the percent performance increase with Turbo Mode enable.
Technorati Tags: core i7, intel i7, chipset, core i7, gadgets, hardware, Intel, Nehalem Chipset, processor

Intel shows working 80-core processor

Last year, Intel announced a project to build a processor that would pack no less than 80 cores. While the idea may seem rather futuristic to some, the chip maker is reported to have already demonstrated the CPU at the Gitex Dubai trade show. Reports say that the Santa Clara based company wasn't shy at all at showcasing the processor, with the demonstration being made in the general public area outside of the trade show.

Intel shows working 80-core processor

As we all know, Intel has other multi-core projects in the pipeline, and Larrabee is one of them. However, the showcased processor was not Larrabee, but another CPU. The company is said to have started working on this CPU long before Larrabee came into play. The showcased CPU features 80 small cores, and is able to deliver 1 Teraflops of computing power. The 80-core chip is said to need only 78.35W of power, and that it features a 3.13GHz clock speed.

According to Fudzilla, Intel also detailed several other features of the CPU. The technology it comes with allows for almost all of the cores to be totally shut down when not needed. Also, it seems that the CPU can downclock all the way to 780MHz in such situations, and that the peak Teraflops performance will drop to 0.01. The CPU would only need 6.45W to compute the 4tile, 4x4 matrix mult withcomm equation.The research processor was built under the 65nm process and the company expects it to be ready for the market in the next five or seven years. It seems that Intel will come out with this eighty-core CPU as a part of the future line of sixteen, thirty two, sixty four CPUs, right before a ninety six-core version. The chip manufacturer considers the multi-core as being the near future for the CPU industry, although such an approach might sound rather idealistic.

Since the current multi-core processors are already facing problems concerning the lack of adequate software able to scale on a large number of cores, Intel should also consider conducting a research project in this area as well, so as to allow users to benefit from all the eighty featured cores.

Technorati Tags:intel, cpu, 80-core, processor, gpu, hardware

Memory Kits For Intel i7 CPUs from OCZ

Memory Kits Optimized for Intel i7 CPUs from OCZ

OCZ Technology unveiled the industry's first triple channel memory kit designed specifically for the impending Intel Core i7 processor / Intel X58 Express Chipset, available in 3GB and 6GB kits.

The new memory modules are Optimized for the Core i7's triple channel mode, combining low voltage requirements, speed, and latency.

Memory Kits For Intel i7 CPUs from OCZ

Developed for enthusiasts and early-adopters, the low voltage OCZ Triple Channel solutions are the choice counterparts for leading-edge performance that won't inhibit the functionality of Core i7 CPUs."OCZ engineered these 3GB and 6GB kits specifically for Intel's imminent platform," commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. "By using special-screened, low voltage-capable ICs, these modules are the perfect complement for the Intel X58 Chipset to deliver the maximum performance by enabling low latency settings and higher system frequency."The advanced memory modules offer clock speeds up to 1600MHz at just 1.65V memory voltage. Elpida memory has also anounced the development of DDR3 memory that match these specifications.

OCZ will release the triple channel kits under the Platinum and Gold series designed specifically for enthusiasts and gamers:

OCZ PC3-10666 Gold 3GB (3X1GB) 1333MHz CL 9-9-9-20 1.65V
OCZ PC3-10666 Gold 6GB (3X2GB) 1333MHz CL 9-9-9-20 1.65V
OCZ PC3-12800 Gold 3GB (3x1GB) 1600MHz DDR3 CL8-8-8-24 1.65V
OCZ PC3-12800 Gold 6GB (3x2GB) 1600MHz DDR3 CL8-8-8-24 1.65V
OCZ PC3-10666 Platinum 3GB (3x1GB) 1333MHz CL7-7-7-20 1.65V
OCZ PC3-10666 Platinum 6GB (3x2GB) 1333MHz CL7-7-7-20 1.65V

OCZ?s Triple Channel kits feature propriety XTC (Xtreme Thermal Convection) heatspreaders. The company has not provided pricing details.

Dual-core Phenom pops up again

Much (digital) ink has run on the subject of dual-core Phenom derivatives. Rumor sites initially expected such chips to launch quad-core Phenoms last year, but we later heard that AMD had shelved the concept until the 45nm switch. Then, 65nm dual-core Phenom listings somehow made their way onto a price search engine in Europe, and unofficial benchmarks of a 2.2GHz model surfaced. We still haven't heard a peep from AMD on the subject, though.

Expreview now claims to have the latest scoop. The Chinese site says AMD may have given up on the 2.3GHz chip we heard about last month, but the chipmaker's October roadmap includes two new dual-core Phenom derivatives. Branded Athlon X2 7550 and Athlon X2 7750, the two CPUs have respective clock speeds of 2.5GHz and 2.7GHz, which they each pair with 3MB of total cache—likely 512KB of the L2 variety per core and 2MB of shared L3 cache per chip.The roadmap reportedly pegs the arrival of these CPUs in the first quarter of next year. However, Expreview says AMD will manufacture them using 65nm process technology, and both models will have 95W thermal envelopes. This claim sounds a tad implausible, although AMD has made some strange moves in the past.

Cooler Master Hyper Z600

When you're looking for a silent cooler for your high-end PC or you want to overclock your CPU to it's maximum sooner or later you'll find yourself buying an expensive water based cooling system or a huge heat pipe cooler. In these days coolers like these are becoming easier to find. Some brands are a bit more interesting to the consumers though, because of their high availability, good reputation and balanced price (if possible), and that's the case with Cooler Master and their new cooler Hyper Z600, which very recently became available.

Cooler Master Hyper Z600

Cooler Master are the definite veterans in cooling technology. The brand is well known around the world and their products can be found in most PC stores. Aside from CPU coolers and full PC cooling solutions, the company also manufactures PC cases, PSUs, modding accessories, and many other things, and is a partner of NVIDIA and many other manufacturers, assisting them in the manufacture of coolers, cases and accessories for their products. Adding those things together makes the expectations for a top quality product logical. And that's exactly what Hyper Z600 is.Cooler Master Hyper Z600 comes well packed in it's cardboard box, wrapped with even more cardboard and a fine synthetic fiber, which helps the radiator fins stay intact even during it's extraction from the box.The size of Hyper Z600 isn't accidental. It's meant to be passive. It's no coincidence that it comes w/o a ventilator and that it has such dimestions. In a modern PC case the CPU cooler rests just below the PSU and often next to another ventilator that pulls air outside the box from behind. The X-Shape design of the Cooler Master Hyper Z600 allows easy airflow from every direction, so the whole work of creating a steady airflow to cool the CPU goes to the PSU this time (especially modern PSUs with a 120mm vent inside) and the rear vent. Of course the 6 heat pipes "take the blame" for supplying the fins with equal heat from each side.

2.93GHz Mobile Core 2 Duo waiting for entry

2.93GHz Mobile Core 2 Duo

2.93GHz Mobile Core 2 Duo

Leading chip maker Intel is expected to release a new Core 2 Duo CPU for portable computer systems sometime in Q1 next year. According to details currently made available, the Santa Clara, California-based company is going to deliver a faster-running mobile CPU, raising the performance level of its current high-speed Core 2 Duo processor, the T9600, which was just released last month.

The upcoming Core 2 Duo mobile CPU is said to deliver a core speed of 2.93GHz, up from the 2.8GHz on the company's current Core 2 Duo T9600. According to Fudzilla, chip maker Intel will release the T9800 CPU at a yet unannounced date in Q1 2009, by which time some users should have already gotten a chance at Intel's next-generation desktop CPUs, the Core i7.As with any officially unreleased product, details on the upcoming Intel mobile processor are rather scarce, but we can tell you that, aside from the higher clock rate, the new T9800 CPU is rather similar to Intel's T9600, as it features the same 1066MHz FSB and 6MB of cache. This means that there's going to be just a slight difference in performance between the two processors. Even so, some users out there might go the extra mile and choose the upcoming T9800 over the current T9600, despite an expected price tag of $530 at launch.

Unfortunately, this sums up just about every detail that is currently available on Intel's upcoming Core 2 Duo mobile processor. Further info should most likely emerge as the official unveiling is drawing near. However, most users will probably be more interested in the company's next-generation Core i7 processors, built on the Nehalem architecture. These new CPUs are said to deliver a new level of performance for upcoming desktop computer systems, and thus further increase Intel's market advantage over competitor AMD.

Intel Steals AMD's Supercomputer Shopper

Cray and Intel announced today that they have established an R&D deal for research on next generation supercomputers. Cray Inc is one of the best supercomputer and high-performance computing manufacturer and mainly has been using AMD processors in its machines. Cray and Intel will be researching on the use of Larabee accelerators in supercomputers.

Larabee is Intel's next-generation GPGPU initiative, which is the cunning plan to use graphic cards to do other computing tasks than just showing graphics. GPU are known to have high-floating point processing capabilities and the industry has decided its time to use it for some math. AMD's ATI acquisition was on similar grounds and AMD today manufactures AMD Stream Processors that do the same thing. Nvidia with its CUDA is also doing a same thing.

AMD must be pretty sad that it hasn't been able to pull something similar with its Stream Processors. AMD Opteron has been pretty popular among supercomputer manufacturers due to scalability brought through HyperTransport architecture. Cray shares seem to have risen due to some excitement with AMD's chip availability, but I suspect its more to do with the Intel partnership.

Stream Processing are going to be the future of high-performance computing. Even on desktops, it'll be either be processors doing GPU work or GPU doing processors work sometime in the future.

AMD Working With Intel

As odd it may seem, the story holds ground and is one of the useful steps for the Centrino 2 platform of notebooks. Fuad Abazovic of Fudzilla claims that AMD is working hard with Intel to develop switchable graphics in future Centrino laptops. AMD is doing this in the notebooks with Puma and wants to have similar technology in notebooks with Intel chips and ATI/AMD graphic cards.

The thing about switchable graphics is that when your laptop is connected to the power unit or had good battery, it will use the graphics card. When the battery is low, it will switch to the onboard graphics. This will save power and make your battery life increase a little. Its generally close to 5-10% improvement, we heard the last time. But for the dying moments of laptop battery, I have experienced that you always remember the important work.

If you look at the image above, you'll see that the plus sign is red, just like red-cross... That's because it's one of the good things being done on the battlefield between Intel and AMD. This news makes you think how bitter rivals AMD and Intel are working together?? But actually its ATI which is working with Intel and I'm sure AMD has told its engineers not to look, talk, have lunch or discuss anything with Intel engineers. They just make faces when they meet and exchange some white documents with each other... Infact, news is that some even show the "middle-finger" to each other :))