Intel ready with its first 8-Core xeon processors

Santa Clara, California-based Intel is expected to detail one of its highest-anticipated server processors at the upcoming International Solid-State Circuits Conference in San Francisco between February 8 and 12, 2009. The chip maker is expected to provide an early look at its first eight-core chip, which will be part of the company's Xeon family of processors. These chips are to provide a new level of performance for server systems based on a dual-socket motherboard.

Unfortunately, at this time, there aren't any details regarding the Xeon processors to be discussed at the February 9 presentation. According to the ISSCC programme, executives of the global leading chip maker will be discussing an 8-core, 16-thread Xeon processor, which will be manufactured using a 45nm process technology. According to additional info, said processor will also be featuring 2.38 transistors and support operation of up to 6.4GT/s.

As expected, Intel is yet to officially comment on the respective Xeon processor, which it will likely do during the ISSCC event. “We are presenting 16 papers at ISSCC, but don't haveanything further to share at this point,” said Nick Jacobs, a company spokesman in Singapore.
According to the available details, Intel's presentation might just be related to the company's highly-anticipated Xeon processor that will be based on the Nehalem EP architecture. This server CPU is known to have been designed specifically for dual-socket servers and workstations. According to previous details, this processor line is due to be released sometime in early 2009.

The upcoming chips will sport some of the features currently available for Intel's other Nehalem-based chips, including the use of Intel's Quick Path Interconnect (QPI), which basically replaces the front side bus, featured on Intel's previous generation of Xeon processors. This feature boosts the computer's overall performance.

AMD finally launches Phenom II and Dragon Platform

AMD's 45nm, quad-core Phenom II has finally arrived. It's available in two flavors, the 2.8GHz X4 920 and the 3.0GHz X4 940 Black Edition, going for $235 and $275, respectively. AMD's naturally touting the ostensible cost savings of the chips . The Dragon platform includes a Phenom II proc, 4800-series Radeon HD graphics and a 790-series motherboard, all of which should combine for low power consumption -- up to 40 percent compared to Phenom processors. Where the Phenom II definitely wins is the fact that some AMD folks will be able to drop in the chip to existing motherboards, but otherwise it looks like value hounds and performance junkies aren't being served by this new chip.

AMD finally launches Phenom II

Performance

The Phenom II's integrated memory controller and HyperTransport interface give it a technical edge over competing Core 2 Quad chips, which lack those features. Intel moved to an integrated memory controller and began incorporating its own version of HyperTransport--dubbed QuickPath Interconnect--only with its Core i7 platform. The integrated memory controller and HyperTransport interface allow Phenom II processors to achieve a higher memory bandwidth than Core 2 Quad processors can, by eliminating the bottlenecks created by a frontside bus and an external controller. The arrangement, in theory, improves system performance.

Model / Processor Frequency:	AMD Phenom II Processor Model X4 940 / X4 920 / 3.0GHz, 2.8GHz
L1 Cache Sizes:	64K of L1 instruction and 64K of L1 data cache per core (512KB total L1 per processor)
L2 Cache Sizes:	512KB of L2 data cache per core (2MB total L2 per processor)
L3 Cache Size:	6MB (shared)
Memory Controller Type:	Integrated 128-bit wide memory controller, capable of being configured for dual 64-bit channels for simultaneous read/writes
Memory Controller Frequency:	Up to 1.8GHz with Dual Dynamic Power Management
Types of Memory:	Support for unregistered DIMMs up to PC2 8500 (DDR2-1066MHz)
HyperTransport 3.0:	One 16-bit/16-bit link @ up to 3600MHz full duplex
Total Processor Bandwidth:	Up to 31.5 GB/s bandwidth
Packaging:	Socket AM2+ 940-pin organic micro pin grid array (micro-PGA) (backward compatible with Socket AM2)
Fab location:	AMD's Fab 36 wafer fabrication facilities in Dresden, Germany
Process Technology:	45nm (.045-micron) DSL Silicon on Insulator (SOI)
Approximate Transistor count:	approx. ~758 million (65nm)
Approximate Die Size:	258 mm2 (45nm)
Nominal Voltage:	.0875-1.5 Volts
Max Ambient Case Temp:	62 degress Celsius
Max TDP:	125 Watts
ACP:	*to be announced after launch
Future Memory Controller Note:	Future 45nm processors versions are planned to include support for DDR3 memory

Availability and Phenom II Processor Pricing

Consumers can expect to see systems featuring Dragon platform technology from leading system builders and OEMs in the first quarter of 2009. In addition to Dragon platform technology-based offerings from AMD’s OEM partners, PC enthusiasts who enjoy building their own systems can search “Dragon” on popular e-tail sites such as newegg.com and tigerdirect.com to find special promotions on this new desktop PC platform.

In addition to Dragon platform technology, individual AMD Phenom II X4 processors will be available from AMD channel e-tailers at launch:

AMD Phenom II X4 940 Black Edition processor – (3.0GHz) – $275 MSRP

AMD Phenom II X4 920 processor – (2.8GHz) – $235 MSRP

Transcend triple channel DDR3-1333 memory kits

Transcend Information Inc has released its DDR3-1333 triple channel memory kits for use with Intel Core i7 processors and Intel X58 Express Chipset motherboards. Transcend’s triple channel kits are designed specifically for the new platform, and offer an optimized combination of low voltage (1.5V), speed and enhanced latency (9-9-9-24) to deliver suitable performance and compatibility with next-generation PCs.

Available in two different capacities of 3GB (1GBx3) and 6GB (2GBx3), Transcend’s DDR3-1333 triple channel memory kits’ three identically matched DDR3 modules are carefully matched for use in triple-channel configuration, which together provide memory bandwidth of up to 32GB/sec. To ensure extra-stability and signal integrity, all DDR3 modules use robust PCBs that fully comply with JEDEC standards.Each chip is manufactured using small Fine-Pitch Ball Grid Array (FBGA) packages with extra contacts to assure better thermal dissipation, electrical efficiency and reliable computing quality.

Transcend memory modules are built to the highest specifications with the finest chips and materials available, and undergo rigorous testing to ensure they provide the best performance possible. All Transcend memory modules come with a lifetime warranty and the support of a global service network.

AMD pushes Fusion platform to 2011

AMD's executives gave an update of th company's progress toward profitability, products, marketing, manufacturing and operational initiatives on Thursday at the company's 2008 Financial Analyst Day in Sunnyvale, Calif.AMD has changed its original plans to introduce chips that combine CPU and and graphics cores to 2011, at a time where the when it will roll its first 32 nm products.

AMD pushes Fusion platform to 2011

The company has canceled its plans to release in 2010 its first dual-core 45 nm processor that would combine graphics and x86 cores. Instead, AMD will inntroduce in 2010 a four-core notebook processor in a BGA package.

AMD's "rival" Intel is expected to release a notebook processor that includes a graphics core in the end of 2009.AMD's first 32 nm processors will be delivered in 2011. The Orochi (UMPC/notebook) and Llano (mainstream desktop/notebook) chips will be the first to use AMD's next-generation Bulldozer core. The desktop chips will have four x86 cores and support four to eight Mbytes cache and DDR3 memory. The Llano chip will also include a graphics core.

Also in 2011, AMD will deliver Ontario, a 32nkm notebook chip with two x86 and one graphics core, supporting DDR3 memory.
Desktop/notebook Roadmap 2009-2010

AMD also provided details bout the CPU roadmap for mobile and desktop PCs for 2009/2010.

In 2009, the 45nm quad-core "Deneb" CPU (8m cache, DDR2/3) will power the entusiast desktop platforms. The "Propos" quad-core chips will be also available at that time featuring 2MB of cache and they will be found at mainstearm desktop PCs.

In the notebook segment for clients, AMD will release in 2009 the new 2-core "Caspian" CPU (2MB cache, DDR2) followed by the quad-core "Champlain" CPU (2MB cache, DDR3) in 2010. For ultramobiles, AMd prepares the "Conesus" (2-core, 1M cache, DDR2) chip for 2009 and the "Geneva" (2-core, 2M cache, DDR3) chip one year later.

Intel Core i7 Nehalem launching on November 17

Intel provided information about its next-generation micro-architecture (Nehalem) with the Core i7 processors at a media event on Wednesday in Athens, Greece, prior to the worldwide official release of the system on November 17.Intel Core i7 Nehalem launching on November 17

The event ran under the headline of "the fastest processor on the planet". The two major characteristics of the new i7 architecture are the triple-channel integrated memory controllers and the new interface called Quick Path Interconnect (QPI). Other highlights include the monolithic die to consolidate all four cores in a single piece of silicon, and the shared L3 cache. Further improvements include the use of the Hyper-threading as well as the Turbo Boost technologies. The Core i7 processors are also optimized to operate with Intel's X58 chipset.The Corei7 series will feature three quad-core models: The 2.66 GHz Core i7 920 will aim for the sub-$1000 class of PCs, the 2.93 GHz Core i7 940 for more expensive PCs in the $1500-$2000 range and the 3.2 GHz 965 Extreme Edition at enthusiast PCs.

The prices (1K pieces) of these CPUs are $999 for the Extreme Edition, $562 for the 940 and $284 for the 920.The X58 Express chipset covers both the northbridge/southbridge operations. The X58 IOH supports up to 36 PCIe 2.0 lanes. Depending on the processor model, QPI may run at either 6.4 GT/sec (Core i7-965) or 6.4 GT/sec (Core i7-940, i7-920) to communicate with the X58 Express chipset in each direction. This is twice the bandwidth of Intel's currently available X48 chipset, plus the full-duplex transport instead of the half-duplex. AMD's HyperTransport 3.0 still has an advantage herewith up to 41.6GB/s of bi-directional bandwidth.However, the X58 Express does not support the legacy PS/2 IDE, serial or parallel ports.

Turbo mode

Under the "TurboMode", the utilization of the number of active cores is used to adjust the frequency. For example, if only two cores are active, then there will be much more headroom within the thermal and power envelope and the CPU will be clocked higher. So the "turbo" frequencies of each core depend on the number of cores active. We could say that this is mainly a power saving feature.

Turbo Mode boasts single threaded applications as well as the performance of multi-threaded applications, according to Intel. Below is a graph that Intel showed with the Core i7 Extreme CPU to process in single-core and quad-core configurations, with Turbo Mode enabled. The graph shows the percent performance increase with Turbo Mode enable.
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Rumours about Intel launching Montevina Platform for notebooks

Intel is going to update its Montevina notebook PC platform in April, 2009 with the introduction of the Montevina Refresh platform, according to a DIGITIMES report, which cites unnamed sources within Intel. The launch of the platform will be accompanied by two new processors, the Core 2 Duo T9900 and P8800.


Intel also plans to unveil its GM47 chipset for high-end notebooks in first quarter of next year. Entry-level and small form factor (SFF) PC will also not be over looked, as Intel will launch the GL43 and GS40 chipsets in July or August.A deluge of new processors for the Centrino 2 platform are soon going to be made available by the world’s leading chip maker. Also, the GM55 chipset for Intel’s upcoming 6th generation Centrino platform, Calpella, will become available in July or August next year.

Dual-core Phenom pops up again

Much (digital) ink has run on the subject of dual-core Phenom derivatives. Rumor sites initially expected such chips to launch quad-core Phenoms last year, but we later heard that AMD had shelved the concept until the 45nm switch. Then, 65nm dual-core Phenom listings somehow made their way onto a price search engine in Europe, and unofficial benchmarks of a 2.2GHz model surfaced. We still haven't heard a peep from AMD on the subject, though.

Expreview now claims to have the latest scoop. The Chinese site says AMD may have given up on the 2.3GHz chip we heard about last month, but the chipmaker's October roadmap includes two new dual-core Phenom derivatives. Branded Athlon X2 7550 and Athlon X2 7750, the two CPUs have respective clock speeds of 2.5GHz and 2.7GHz, which they each pair with 3MB of total cache—likely 512KB of the L2 variety per core and 2MB of shared L3 cache per chip.The roadmap reportedly pegs the arrival of these CPUs in the first quarter of next year. However, Expreview says AMD will manufacture them using 65nm process technology, and both models will have 95W thermal envelopes. This claim sounds a tad implausible, although AMD has made some strange moves in the past.

New Chip Design to Challenge AMD from INTEL

Intel Corp. cracked the lid Tuesday on a new chip design that is at once a big challenge to smaller rival Advanced Micro Devices Inc. and an admission that AMD nailed a key design feature before it slipped into a severe financial slump.

Intel, the world's largest computer chip maker, showed off the new blueprint, known as a microarchitecture, for its chips at a developers conference in San Francisco.Though some of the details were already known, the design's formal unveiling represented another demonstration of Intel's advantage over AMD in cranking out new chip designs once every two years, a factor that helped send AMD's stock price down 5 percent in an overall down day for technology shares.

AMD has racked up nearly $5 billion in losses during the past 18 months and last month replaced Hector Ruiz, who had been running AMD for six years, with a new chief executive, Dirk Meyer.

The details of Intel's microprocessor architecture are always highly technical. But they're also closely watched because of the ubiquity of Intel's chips in personal computers and corporate servers.

One of the most significant changes was already known. Intel now plans to build a part called an integrated memory controller - which moves information between the microprocessor and the computer's memory - directly into the processor itself.

That's a key change because processors are asked to do more and more, and any lag in communication can seriously hurt performance. AMD has already been incorporating integrated memory controllers into its processors.

Because of that and other tweaks, Intel said its new design, which is code-named Nehalem, will triple the speed at which data can be written to memory or read back, compared to previous generations. Intel says Nehalem also will have nearly double the 3-D animation capabilities as past chips, and better utilize the multiple "cores," or processing engines, on each chip.

Chip makers are adding multiple cores to their chips, essentially jamming many separate processors onto the same slice of silicon, to make sure they're able to continue ramping up performance without running into overheating problems.

Intel said four-core Nehalem chips, which are due to be in production by the end of 2008 and will first target servers and desktop computers and later laptops, have the ability to turn individual cores on and off and can be programmed to boost the speed of active cores when the workload ramps up.